13.1 R10000 Single-Chip Package, 599CLGA
Mechanical Characteristics
The 599CLGA has lands on a straight 1.27mm (.050inch) grid. It is a cavity-down, multi-layer ceramic package with an integral copper-tungsten slug, and is designed for use with a socket. Preliminary information suggests that the 599CLGA can withstand a force of 100 kilograms applied to the CuW slug, without damage, and a PWB assembly should insure that this force is not exceeded. Drawings for a reference LGA-PWB assembly are included in this chapter.
Copyright 1995, MIPS Technologies, Inc. -- 29 JAN 96
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